The FT's Christian Davies and Qianer Liu look into why the world’s leading chipmakers are investing billions of dollars into expanding and improving advanced packaging techniques. Experts believe that the growth of advanced packaging could offer an opportunity for second-tier chipmakers and traditional packaging companies to gain a larger share of the $500bn semiconductor market. Read the article in full here: https://www.ft.com/content/19710eda-b4c3-488b-a42a-1c6b25c18a12
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